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(1/2) Chip Beads(SMD Array) For General Signal Line MZA Series MZA1608 Type FEATURES * A single MZA series chip provides noise attenuation for four lines, making it ideal for use with I/O lines of various highly miniaturized. * Electronic equipment, such as portable products, which comprise high density circuitry. * Low crosstalk between adjacent circuits. * Internal electrodes feature low DC resistance, minimizing wasteful power consumption. * Electroplated terminal electrodes accommodate reflow soldering. * Monolithic structure ensures high reliability. * It is a product conforming to RoHS directive. APPLICATIONS High-frequency noise countermeasure in computers, printers, VCRs, televisions, portable telephones, and other equipment. PRODUCT IDENTIFICATION MZA 1608 S 121 C T (1) (2) (3) (4) (5) (6) (1) Series name (2) Dimensions Lx W (3) Material code (4) Nominal impedance 121:120 at 100MHz (5) Characteristic type (6) Packaging style T:Taping RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING Conformity to RoHS Directive SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN 1.60.1 Ferrite 0.80.1 0.15 0.5 0.4 0.2 Dimensions in mm Terminal electrode 1.1 to 1.4 0.4 0.50.1 0.2 CIRCUIT DIAGRAM * No polarity TEMPERATURE RANGES Operating/storage -55 to +125C PACKAGING STYLE AND QUANTITIES Packaging style Taping Quantity 5000 pieces/reel 10s max. 250 to 260C 230C Natural cooling 180C 150C Preheating 60 to 120s Time(s) Soldering 30 to 60s HANDLING AND PRECAUTIONS * Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150C. * After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. * The inductance value may change due to magnetic saturation if the current exceeds the rated maximum. * Do not expose the inductors to stray magnetic fields. * Avoid static electricity discharge during handling. * When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 350C. Soldering time should not exceed 3 seconds. * This product does not apply to flow soldering construction method. * Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. * Please contact our Sales office when your application are considered the following: The device's failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) * All specifications are subject to change without notice. 001-01 / 20070723 / e9421_mza1608.fm (2/2) ELECTRICAL CHARACTERISTICS Part No. MZA1608S800C MZA1608S121C MZA1608S241C Impedance ()[100MHz] 8025% 12025% 24025% DC resistance ()max. 0.35 0.4 0.5 Rated current (mA)max. 150 150 150 Test equipment: E4991A or equivalent Test tool: 16192A or equivalent Test temperature: 2510C TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MZA1608S800C MZA1608S121C 160 140 Impedance() Impedance() MZA1608S241C 400 350 300 250 200 150 100 50 10000 0 1 10 100 1000 Frequency (MHz) 10000 X 250 200 Z Z 100 80 60 40 20 0 1 10 150 100 50 R X Impedance() 120 Z R R X 100 1000 Frequency (MHz) 10000 0 1 10 100 1000 Frequency (MHz) PACKAGING STYLES REEL DIMENSIONS TAPE DIMENSIONS 1.5 +0.1 -0.0 1.750.1 300min. Dimensions in mm 2.30.2 3.50.05 8.00.3 0.8max. 1.30.2 4.00.1 2.00.05 4.00.1 160min. Taping 200min. Dimensions in mm Drawing direction Sprocket hole 1.0 Cavity 2.00.5 o130.5 o210.8 o1782.0 9.00.3 13.01.4 * All specifications are subject to change without notice. 001-01 / 20070723 / e9421_mza1608.fm o602.0 |
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